DERNFU ELECTRONIC(DONGGUAN)CO.,LTD.

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FR4 Single-Sided PCB

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Detailed Product Description

Process capacity

Product category:single,dorble-sided/multi-layer(2-36)HASLPlated Goldlmmersion Gold/Tin/silver.HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB, Teflon Board, and HDI

Base materialFR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3,Teflon

Max processing dimensions700mm×600mm

Thickness of board0.2mm-3.4mm

Outline Process Precision:±0.08mm

oard Width of the Inner Layer :0.075-1.6mm

Exterior Copper Width :18-210um

Exterior Copper Width :12-210um

Minimum Width of the Welding Ring :0.10mm

Minimum Width of Bridge with Solder Mask :0.01mm

Tolerance of Solder Resistance:±5%

Thickness of base copper foil18μ35μ70μ

Min. hole size0.1mm

Hole dia. Tolerance(PTH):±0.075mm

Hole dia. Tolerance(NPTH):±0.05mm

Min. line Space 0.075mm

Min. line Width(PTH)0.075mm

BURIED/BLIND VIA:compaction or HDI

Solder maskliquid photo-imageable (LPI) solder mask and thermosetting solder mask( Green, Yellow, Red , Black, Blue )

PROFILING METHOD:PUNCH,CNC,HANDSET,TRIMMING

Surface Treatment :HAL, Plated Nickel/ Gold, Immersion Gold, Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, Tin Plating ,Immersion Silver, Immersion Tin, Thickly Plated Gold Finger, Immersion Gold+ Thickly Plated Gold Finger, Immersion Silver + Thickly Plated Gold Finger, Immersion Gold + OSP

Tolerence of contour processing+0.1mm

Being flame-resistant characteristic:94V-0

Twist and wrap:< 0.5%

Specification: under IPC-600F class-II ,IPC-ML-950 or customer`s requirement

CERTIFICATEUL NO. E305540;TL9000,ISO9002;ISO14001:2004;QS9000;TS16949,E169497